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AMSIC Research Lab Members |
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Current Ph.D. Students |
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Past Group Members |
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Peter Grossmann Ph.D. Dissertation: “Design and analysis of minimum energy FPGAs”, May 2013 M.S.: University of Washington, Seattle, WA B.S.: Harvey Mudd College, Claremont, CA Research Interests: Low-energy computing, FPGA architecture, FPGA and VLSI CAD, computer arithmetic Industry Experience before Graduation: MIT Lincoln Laboratory, Lincoln Scholars, 2009-2013 First Position after Graduation: MIT Lincoln Laboratory (Lexington, MA), Technical Staff |
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Brandon Smith (Gordon Engineering Leadership Program) M.S.: Northeastern University, Boston, MA B.S.: University of Hartford, Hartford, CT Research Interests: Embedded systems design, closed-loop control, functional safety development, international standards compliance Industry Experience: Instron, (Norwood, MA), Embedded Systems Design, Retrofit Design, International Standards Compliance, Cable Harness Design, Functional Safety Development, Custom Systems Design, Oct. 2010 - graduation (continued afterwards) LTK Engineering Services, (Boston, MA), Traction Power System Design and Test, Rail Vehicle Design, Qualification Testing, Commissioning Testing, June 2007 - Oct. 2010 |
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Mahmoud Ayman Ahmed Ibrahim Ph.D. Dissertation: “Low-Power Integrated Transceiver Design for Wireless Devices in the Internet of Things”, August 2021 M.S.: Cairo University, Giza, Egypt B.S.: Cairo University, Giza, Egypt Research Interests: RF IC design, low-power ICs, MEMS sensor interface circuits, DC-DC converters, energy harvesting Industry Experience: Qualcomm Technologies, Inc. (San Diego, CA), Analog and Mixed-Signal IC Design Intern, PLL team, May 2018 - Aug. 2018 First Position after Graduation: MediaTek, Inc. (Woburn, MA), Staff Design Engineer |
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Hari Chauhan Ph.D. Dissertation: “Digitally-Assisted Design, Simulation and Testing Techniques for Optimization of Analog/RF Integrated Circuits”, April 2016 M.S.: Northeastern University, Boston, MA M.Tech.: Center for Development of Advanced Computing (C-DAC), Noida, India B.E.: Dr. Babasaheb Ambedkar Marathwada University (BAMU), Aurangabad, India Research Interests: Design of digital, analog, radio frequency, and mixed-signal integrated circuits; built-in test and calibration techniques for systems-on-a-chip Industry Experience: Analog Devices, Inc. (Cambridge, MA), Research Intern, Lyric Labs, May 2013 - Aug. 2013. Center for Development of Advanced Computing (Noida, India), Project Engineer, Jan. 2006 - May 2009. First Position after Graduation: Analog Devices, Inc. (Cambridge, MA), Emerging Business Innovations System Design and Applications Engineer |
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Seyed Alireza Zahrai Ph.D. Dissertation: “Integrated Circuit Design Techniques for High-Speed Low-Power Analog-to-Digital Converters and On-Chip Calibration of Sensor Interface Circuits”, August 2017 M.S.: Iran University of Science and Technology, Tehran, Iran B.S.: University of Tehran, Tehran, Iran Research Interests: Analog and mixed-signal IC design, RF IC design, data converters, systems-on-a-chip (SoC) and ASICs, integrated circuits for medical applications Industry Experience: CSR Technology Inc. (Tempe, AZ), Analog and Mixed-Signal IC Design Intern, RFAMS IC Design Group, Sept. 2013 - Dec. 2013 First Position after Graduation: Marvell Semiconductor, Inc. (Santa Clara, CA), Senior Analog Design Engineer |
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Yuchi Ni M.S. Thesis: “CMOS relaxation oscillator design with an on-chip circuit for combined temperature-compensated reference voltage and current generation”, December 2013 B.S.: Chengdu University of Information Technology, Chengdu, China Research Interests: Analog and RF IC design; design of mixed-signal integrated circuits, integrated circuits for medical applications First Position after Graduation: Chengdu Corpro Technology Co., Ltd. (Chengdu, China), Analog IC Design Engineer |
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Junpeng Feng M.S. Thesis: “Low-power amplifier design for differential temperature sensors in built-in testing applications”, December 2013 B.S.: Shenyang University of Technology, Shenyang, China Research Interests: Design of analog and mixed-signal integrated circuits; on-chip temperature sensors for thermal monitoring and built-in testing First Position after Graduation: Wuxi Chaoyu Microelectronics Co., Ltd. (Wuxi, China), Analog IC Design Engineer |
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Li Xu M.S. Thesis: “Low-Power RF Circuit Design and Built-In Test Current Generation Techniques for Wireless Chips in Emerging Sensing Applications”, March 2016 B.S.: Tongji University, Shanghai, China Research Interests: Design of analog ICs, built-in test and calibration techniques for systems-on-a-chip Industry Experience before Graduation: Linear Technology Corporation (Colorado Springs, CO), Design Intern, Jun. 2015 - Aug. 2015 First Position after Graduation: Ph.D. Student at the University of Michigan (Ann Arbor, MI) |
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Kainan Wang M.S. Thesis: “High Performance Filter and Variable Gain Amplifier Design for Biosignal Measurement Devices”, December 2015 B.S.: Binghamton University, Binghamton, NY Research Interests: Design of analog and mixed-signal integrated circuits, integrated circuits for medical applications Industry Experience before Graduation: Analog Devices, Inc. (Wilmington, MA), Product Engineering Intern, Jun. 2015 - Aug. 2015. First Position after Graduation: Analog Devices, Inc. (Wilmington, MA), Applications Engineer |
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Kaidi (Kate) Du B.S.: Electrical Engineering, Fall 2015 Project: Digitally programmable lowpass-notch filter design for CMOS front-ends in biosignal measurement applications Industry Experience before Graduation: State Street Global Advisor (Boston, MA), IT Management Information System Project Management Intern, June 2014 - Dec. 2014 MBTA Power Department (Charlestown, MA), Electrical Engineer Intern, Jan. 2013 - June 2013 First Position after Graduation: M.S. Student at the University of California, Berkeley |
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Scott Eaton B.S.: Electrical Engineering, Spring 2014 Project: Calibration of a differential temperature sensor for on-chip power monitoring Industry Experience before Graduation: MC10 Inc. (Cambridge, MA), Engineering Intern, Jan. - Aug. 2013 First Position after Graduation: Cascon Inc. (Yarmouth, ME), Project Design Engineer |
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Marina Zlochisti M.S. Thesis: “Digitally-Assisted Design and Calibration for High Performance Flash Analog-to-Digital Converters”, August 2018 B.S.: Tel Aviv University, Tel Aviv, Israel Research Interests: Design of analog and mixed-signal integrated circuits Industry Experience before Graduation: Intel Corporation (Jerusalem, Israel), Analog Engineer, July 2011 - January 2014 First Position after Graduation: Infineon Technologies (Andover, MA), Mixed-Signal Design Engineer |
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Ibrahim Farah B.S.: Electrical Engineering, Spring 2016 Project: CMOS comparator design for the detection of test signals during the calibration of an analog front-end for biosignal measurements Industry Experience before Graduation: GE Oil & Gas (Billerica, MA), Electrical Engineering Intern, Jan. 2014 - June 2014 Draper Laboratory (Cambridge, MA), Software Engineering Intern, Jan. 2013 - Dec. 2013 First Position after Graduation: Systems & Technology Research (Woburn, MA), Sensors & Signal Processing Engineer |
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Nicolas Le Dortz Visiting Scientist sponsored by Analog Devices, Inc. (part-time), March 2015 - March 2016 Ph.D.: Centrale-Supélec, Paris, France M.S.: Royal Institute of Technology (KTH), Stockholm, Sweden M.S.: École Polytechnique, Paris, France B.S.: École Polytechnique, Paris, France Project in the AMSIC Group: High-speed low power SAR ADC design Research Interests: Analog and mixed-signal IC design, time-interleaved ADCs, digitally-assisted analog design, signal processing Industry Experience: Analog Devices - Lyric Labs (Cambridge, MA), Research Scientist, started March 2015 STMicroelectronics (Crolles, France), Nov. 2011 - Oct. 2014 |
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Matthew Oliver (Gordon Engineering Leadership Program) M.S.: Northeastern University, Boston, MA B.S.: University of New Hampshire, Durham, NH Research Interests: Magnetics, applications of graphene in ICs Industry Experience: Analog Devices, Inc. (Norwood, MA), Product/Test Engineer, Jul. 2009 - graduation (continued afterwards) Linear Technology Corporation (Auburn, NH), Analog IC Design Intern, Jun. 2008 - Aug. 2008. |
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Chun-hsiang Chang Ph.D. Dissertation: “Radio Frequency and Analog CMOS Integrated Circuit Design Methods for Low-Power Medical Devices with Wireless Connectivity”, November 2015 M.S.: Texas A&M University, College Station, TX B.S.: National Taiwan University of Science and Technology, Taipei, Taiwan Research Interests: Design of analog and radio frequency ICs, integrated circuits for medical applications First Position after Graduation: OmniVision Technologies, Inc. (Santa Clara, CA), Analog Design Engineer |
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Mengting Yan Ph.D. Dissertation: “Integrated Circuit Design Methods for Temperature-based Hardware Trojan Detection and Parametric Frequency Division in Next-Generation Systems-on-a-Chip”, August 2023 B.S.: Beihang University, Beijing, China Research Interests: Analog and mixed-signal IC design, on-chip temperature sensors for security applications, integrated circuits for medical applications Industry Experience: Qorvo, Inc. (Chelmsford, MA), RF/Analog SOI Design Intern, Infrastructure Defense Product (IDP) team, Sep. 2020 - Dec. 2020 First Position after Graduation: Analog Devices, Inc. (Chandler, AZ), Senior Analog Design Engineer |
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Gaurav Jha M.S. Thesis: “Low-Power and Low-Voltage Bandpass Filter Design for Wireless Receiver Applications”, Summer 2019 B.S.: SRM University, Chennai, India Research Interests: Design of analog and mixed-signal ICs, RF IC design, low-power ICs Industry Experience before Graduation: Analog Devices, Inc. (San Jose, CA), System Applications Engineering Intern, Emerging Business Group, July 2018 - Dec. 2018 First Position after Graduation: Analog Devices, Inc. (Wilmington, MA), Product Engineer |
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Zoe Nelson B.S./M.S. Project: “Inductorless 400MHz Low Power LNA Design with Large-Scale Linearization Method”, Spring 2019 Research Interests: Analog and mixed-signal IC design Industry Experience before Graduation: RKF Engineering (Washington, D.C.), Software Engineer, January 2017 - June 2017 Analog Devices, Inc. (Wilmington, MA), Reliability Engineer, January 2016 - June 2016 First Position after Graduation: Ph.D. Student at the University of Pennsylvania (Philadelphia, PA) |
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Former High School Interns |
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Sofia Conte Summer 2017 Research Internship (in association with Northeastern University's Young Scholars Program) Montrose School
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Cameron Young Summer 2016 Research Internship (in association with Northeastern University's Young Scholars Program) Medfield High School
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Emily O’Neill Summer 2016 Research Internship (in association with Northeastern University's Young Scholars Program) Cardinal Spellman High School
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Nina Taneja Summer 2017 Research Internship (in association with Northeastern University's Young Scholars Program) Milton Academy
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Haoran Wei M.S. Project: “Noise Reduction via Chopper Stabilization of Fully Differential Temperature Sensors for Hardware Security Applications”, Spring 2020 B.S.: University of Bridgeport, CT Research Interests: Analog and digital integrated circuits, on-chip thermal sensing for error detection Industry Experience before Graduation: Synopsys (Boxborough, MA), Electrical Engineering Intern, Aug. 2019 - Dec. 2019 Synopsys (Shanghai,China), Electrical Engineering Intern, May 2018 - Aug. 2018 First Position after Graduation: 2Pai Semiconductor Co. (Shanghai, China), Analog IC Designer |
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Michael Klimovitsky (Gordon Engineering Leadership Program) M.S.: Northeastern University, Boston, MA B.S.: Northeastern University Research Interests: IC Test, programming, optimization Industry Experience: Analog Devices Inc. (Wilmington, MA), Test Engineer, 2013 - (continued afterwards) QinetiQ North America, Inc. (Waltham, MA), Robotics Intern, July 2012 - December 2012 MC10 Inc. (Somerville, MA), Electrical Co-op, July 2011 - December 2011 |
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Aaron Rackoff B.S.: Electrical Engineering, Fall 2017 Project: Subthreshold Inductorless 400 MHz Low-Noise Amplifier with Sub-Milliwatt Power Consumption in a 130nm CMOS Process Industry Experience before Graduation: Charles Stark Draper Laboratory, Inc. (Cambridge, MA), Electrical Engineer (co-op), May 2016 - Dec. 2017 |
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Keng Chen Ph.D. Dissertation: “Design of Accurate and Responsive Power Management Integrated Circuits for Microprocessor Systems”, April 2022 M.S. (Electrical Engineering): Columbia University, New York, NY M.S. (Lighting): Rensselaer Polytechnic Institute, Troy, NY B.S.: Fudan University, Shanghai, China Research Interests: Power management IC design, analog IC design Industry Experience: Infineon Technologies (Andover, MA), Staff Mixed-Signal Design Engineer, 2016 - 2022 Osram Sylvania (Wilmington, MA), Senior Power Supply Engineer, 2010 - 2016 WAC Lighting (Garden City, NY), Electrical Engineer, 2009 - 2010 First Position after Graduation: Intel Corp., (Hudson, MA), Staff Analog IC Design Engineer |
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Rohit Chopra Summer 2018 Research Internship (in association with Northeastern University's Young Scholars Program) Community Charter School of Cambridge
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Brian Estevez Summer 2018 Research Internship (in association with Northeastern University's Young Scholars Program) Urban Science Academy
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Safaa Abdelfattah Email: abdelfattah.s<at>northeastern.edu M.S.: Cairo University, Giza, Egypt B.S.: Cairo University, Giza, Egypt Ongoing Project: Digitally-assisted analog design for low-power EEG signal acquisition chips Research Interests: Analog IC design, digital IC design, mixed-signal design, SerDes design, ADPLL design Industry Experience: Skyworks Solutions, Inc. (Andover, MA), Analog and Mixed-Signal IC Design Intern, Diversified Analog and AI Solutions (DAS) team, May 2023 - December 2023 |
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Mohamed A. Mohamed (Co-Advised with Prof. Miriam Leeser) M.S. Thesis: “Strategies and Implementations to Support Multiple Wireless Protocols with a Single RF Front-End”, Spring 2019 B.S.: University of Massachusetts, Amherst Research Interests: RF Wireless Communication, RF circuits Industry Experience before Graduation: MathWorks (Natick, MA), Development Engineering Intern, RF and EM Team, May - Aug. 2018 First Position after Graduation: MIT Plasma Science and Fusion Center (Cambridge, MA), RF Engineering Specialist |
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Isabel Martos-Repath M.S. Project: “Modeling of Magnetoelectric Antennas for Circuit Simulations in Magnetic Sensing Applications”, Fall 2020 B.S.: Harvey Mudd College, Claremont, CA Research Interests: RF IC design, wireless power & communication Industry Experience: Bose Corporation (Framingham, MA), EE/Technical Intern, Advanced Research & Concept Development Group in the Consumer Electronics Division, January - June 2020 First Position after Graduation: Ph.D. Student at Northeastern University. |
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Marvin Onabajo |
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Jay Park Summer 2019 Research Internship (in association with Northeastern University's Young Scholars Program) Newton South High School
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David Abrahamyan Summer 2019 Research Internship (in association with Northeastern University's Young Scholars Program) Watertown High School
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Diptashree Das Email: das.d<at>northeastern.edu M.S.: Texas Tech University, Lubbock, TX M.S.: West Bengal University of Technology, India B.S.: West Bengal University of Technology, India Ongoing Project: Transceiver design for neural activity monitoring Research Interests: Analog and mixed-signal IC design, RF IC design, integrated circuit design for wireless communication and medical applications Industry Experience: Qorvo, Inc. (Chelmsford, MA), High Speed RF SOI Design Intern, Infrastructure Defense Product (IDP) team, May 2022 - April 2023 |
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Analog & Mixed-Signal Integrated Circuit (AMSIC) Research Laboratory |
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Lanai Carey Summer 2021 Research Internship (in association with Northeastern University's Young Scholars Program) Bridgewater-Raynham Regional High School
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Barthelemy Lagene Summer 2021 Research Internship (in association with Northeastern University's Young Scholars Program) Waltham Senior High School
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Thomas Gourousis Email: gourousis.t<at>northeastern.edu Diploma: University of Patras, Patras, Greece Ongoing Project: RF circuits for parametric phase noise reduction, temperature sensors for on-chip performance monitoring Research Interests: Analog/RF and mixed-signal IC design |
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Minghan Liu Email: liu.minghan<at>northeastern.edu M.S.: Tufts University, Medford, MA B.S.: Hohai University, Jiangsu, China Ongoing Project: Analog/RF circuit design for optimization with radio real-time machine learning Research Interests: Analog filters, mixers and low-noise amplifiers |
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Yunfan Gao Email: gao.yunfa<at>northeastern.edu M.S.: Columbia University, New York, NY B.S.: Tianjin University, Tianjin, China Ongoing Project: Adaptive interference-tolerant RF receivers design Research Interests: Analog and mixed-signal IC design, RF IC design, power management IC design |
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Biography |
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Sponsors |
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NSF RINGS Project |
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Students |
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Alexis Chen Summer 2023 Research Internship (in association with Northeastern University's Young Scholars Program) Lexington High School
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Brendan O'Riordan Summer 2023 Research Internship (in association with Northeastern University's Young Scholars Program) Boston Latin School
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Current M.S. Student |
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Junyi Yang Email: yang.juny<at>northeastern.edu B.S.: Northeastern University, Boston, MA Ongoing Project: On-chip temperature sensor design Research Interests: Analog and digital IC design, RF IC design, mixed-signal design |
